[{"data":1,"prerenderedAt":77},["ShallowReactive",2],{"post-309ae2b657eb20a1b58":3,"recom-309ae2b657eb20a1b58":22},{"summary":4,"updateTime":5,"title":6,"cateName":7,"content":8,"tags":9,"cover":10,"createTime":11,"cateId":12,"isTop":13,"nickname":14,"siteId":15,"id":16,"isPage":13,"slug":17,"views":18,"status":19,"uid":16,"coverImageUrl":20,"createDate":21,"cate":12,"keywords":9},"Ten Daily Electronic Common Sense-Section-164 Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.",1776841290165,"Ten Daily Electronic Common Sense-Section-164","Tutorials","\u003Cfigure class=\"wp-block-image size-large is-resized\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" decoding=\"async\" src=\"/uploads/2023/01/01-1-650x303.png\" alt=\"\" class=\"wp-image-14621\" width=\"838\" height=\"391\" srcset=\"uploads/2023/01/01-1-650x303.png 650w, uploads/2023/01/01-1-400x186.png 400w, uploads/2023/01/01-1-250x117.png 250w, uploads/2023/01/01-1-768x358.png 768w, uploads/2023/01/01-1-150x70.png 150w, uploads/2023/01/01-1-800x373.png 800w, uploads/2023/01/01-1.png 869w\" sizes=\"(max-width: 838px) 100vw, 838px\" />\u003C/figure>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What is the design procedure for the LT3825/37 transformer?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The LT3825 and LT3837 are power management ICs designed for driving transformers in isolated power supply applications. To design a transformer for these ICs, you typically follow these steps:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Determine the Specifications: Start by determining the required specifications of the transformer based on your application requirements. These specifications include input voltage, output voltage, output power, switching frequency, and any other specific requirements for your power supply.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Select Core Material: Choose the appropriate core material for the transformer based on the desired operating frequency and power level. Common core materials include ferrite and powdered iron, each with its advantages and limitations.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Calculate Turns Ratio: Calculate the turns ratio of the transformer based on the input and output voltages. The turns ratio determines the voltage conversion between the primary and secondary windings.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Determine Inductance: Calculate the required inductance of the primary winding using the following formula: L_primary = (Vin_min * Duty_cycle) / (f_sw * ΔI_L) where Vin_min is the minimum input voltage, Duty_cycle is the duty cycle of the converter, f_sw is the switching frequency, and ΔI_L is the allowed ripple in the inductor current.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Select Wire Gauges: Choose the appropriate wire gauges for the primary and secondary windings based on the required current carrying capacity and the allowed temperature rise.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Design Magnetic Structure: Design the magnetic structure of the transformer, including the core shape, size, and number of turns to meet the required inductance and coupling.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Consider Leakage Inductance and Interwinding Capacitance: Consider the leakage inductance and interwinding capacitance to ensure proper operation and minimize voltage spikes.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Optimize for Efficiency: Optimize the transformer design for efficiency and minimize losses, considering factors like core losses, copper losses, and proximity losses.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Thermal Considerations: Ensure that the transformer operates within safe temperature limits under worst-case conditions.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Prototype and Test: Build a prototype of the designed transformer and test it with the LT3825 or LT3837 IC to verify its performance. Adjust the design if necessary based on the test results.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Please note that transformer design can be complex and requires a good understanding of power electronics and magnetics. It is recommended to use simulation tools and consult with experienced power supply designers or transformer manufacturers to ensure a reliable and efficient design. Additionally, always refer to the manufacturer’s datasheets and application notes for detailed design guidelines specific to the LT3825 and LT3837 ICs.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What is the main component of the resonant piezoelectric deflagration sensor?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The main component of a resonant piezoelectric deflagration sensor is a piezoelectric crystal. Piezoelectric crystals are materials that can generate an electrical charge when mechanical stress or pressure is applied to them, and they can also undergo mechanical deformation when subjected to an applied electrical field.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>In a resonant piezoelectric deflagration sensor, the piezoelectric crystal is used to detect the pressure or shockwave generated by a deflagration event, which is a type of combustion process where the reaction propagates at subsonic speeds. When a deflagration occurs, it generates a pressure wave that impinges on the piezoelectric crystal, causing it to undergo mechanical deformation. This mechanical deformation leads to a change in the crystal’s electrical charge, producing an electrical signal that can be detected and analyzed.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The resonant aspect of the sensor refers to the use of the piezoelectric crystal’s inherent resonant frequency. By operating the crystal at its resonant frequency, the sensor can achieve higher sensitivity and selectivity to the deflagration events, improving its detection capabilities.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The electrical signal generated by the piezoelectric crystal can be processed and analyzed using electronic circuits to determine the characteristics of the deflagration event, such as its intensity, duration, and frequency content. Resonant piezoelectric deflagration sensors are commonly used in various applications, including industrial safety systems, combustion monitoring, and detection of deflagration events in enclosed spaces.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>It’s important to note that the complete sensor system may include additional components such as signal conditioning circuitry, amplifiers, filters, and microcontrollers for data processing and communication. However, the key component responsible for detecting the deflagration event and converting it into an electrical signal is the piezoelectric crystal.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What are the three elements of force?What is power?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The three elements of force are:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Magnitude: The magnitude of force refers to the strength or intensity of the force. It is represented by a numerical value and is typically measured in units of Newtons (N) in the International System of Units (SI).\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Direction: The direction of force is the line along which the force is applied. It is represented by an arrow or vector indicating the force’s orientation. Force is a vector quantity, which means it has both magnitude and direction.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Point of Application: The point of application of force is the specific location or point where the force is applied to an object or body. It helps define the exact location on the object where the force is acting.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Power is the rate at which work is done or the rate at which energy is transferred or converted. It is a measure of how quickly work is performed or energy is expended. The SI unit of power is the Watt (W), which is equivalent to one joule of work done per second. Mathematically, power (P) is calculated as:\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>Power (P) = Work (W) / Time (t)\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>Where: P = Power in Watts (W) W = Work done or energy transferred in joules (J) t = Time taken in seconds (s)\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>Power is a scalar quantity, meaning it has only magnitude and no direction. In various contexts, power can refer to mechanical power (in machines and engines), electrical power (in circuits and devices), thermal power (in heating and cooling systems), and so on. It is an essential concept in physics and engineering, helping to describe the rate of energy conversion and the performance of various systems and devices.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What is an FPGA?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>FPGA stands for Field-Programmable Gate Array. It is a type of integrated circuit (IC) that can be programmed or configured by a user or designer after manufacturing. Unlike application-specific integrated circuits (ASICs), which are designed for specific tasks and cannot be changed once manufactured, FPGAs offer flexibility and reconfigurability.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>FPGAs consist of an array of programmable logic blocks, configurable interconnects, and input/output (I/O) blocks. These components allow users to implement digital logic circuits, such as combinational logic, sequential logic, and arithmetic functions, by programming the FPGA with a hardware description language (HDL) like Verilog or VHDL.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The key components of an FPGA are:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Logic Blocks: These are the fundamental building blocks of an FPGA. Each logic block typically contains a lookup table (LUT) that can implement any combinational logic function, flip-flops for sequential logic, and multiplexers for routing signals.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Interconnects: The interconnects are the programmable pathways that connect different logic blocks and I/O blocks. These pathways allow users to establish the desired connections between various components on the FPGA, enabling the creation of complex digital circuits.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Input/Output Blocks: These blocks provide the interface between the external world and the internal logic of the FPGA. They allow the FPGA to communicate with other devices or systems, and they can be configured to support different types of interfaces, such as digital I/O, analog I/O, and communication protocols like UART, SPI, or Ethernet.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>The reprogrammability and parallel processing capability of FPGAs make them suitable for a wide range of applications, including digital signal processing, telecommunications, aerospace, industrial automation, machine learning, and more. Designers can customize the FPGA to meet the specific requirements of their application, which provides advantages in terms of performance, power efficiency, and time-to-market.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>FPGAs offer a powerful platform for prototyping and implementing digital systems, allowing for rapid development and iteration of complex designs without the need for custom ASIC fabrication.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>There are several reasons for using Quartus instead of MAX PLUS：\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>Quartus and MAX+PLUS II are both software tools developed by Intel (formerly Altera) for designing and programming FPGA devices. Quartus is a more recent and advanced software tool compared to MAX+PLUS II. Here are several reasons for using Quartus instead of MAX+PLUS II:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>FPGA Device Support: Quartus supports a wider range of FPGA families, including the latest Intel FPGA devices. As FPGA technology evolves, newer devices with more advanced features and capabilities are introduced, and Quartus is regularly updated to support these devices.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Advanced Features: Quartus offers more advanced features, optimizations, and design tools. It provides a better user experience with improved project management, design entry, and simulation capabilities.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Performance and Efficiency: Quartus provides better optimization algorithms, resulting in improved performance and efficiency for FPGA designs. It allows designers to achieve higher clock frequencies and better resource utilization.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Timing Analysis and Closure: Quartus has more robust timing analysis and closure tools, helping designers to meet critical timing requirements and avoid timing violations in complex designs.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>IP Cores and Libraries: Quartus comes with a comprehensive set of intellectual property (IP) cores and libraries, enabling designers to easily integrate standard functions into their designs, saving time and effort.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Ecosystem and Community: Quartus benefits from a larger and more active user community, providing access to a wealth of online resources, forums, and support, making it easier to find help and solutions to design challenges.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Software Updates and Support: Quartus is actively maintained and receives regular updates, bug fixes, and enhancements. On the other hand, MAX+PLUS II may no longer receive updates as it is an older tool.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Integration with Intel Tools: As Intel (formerly Altera) continues to innovate and develop new tools and technologies, Quartus is tightly integrated with other Intel tools, such as Intel Quartus Prime Standard/Pro and the Nios II Embedded Design Suite.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Please note that the specific features and capabilities of Quartus and MAX+PLUS II may have changed or evolved since my knowledge cutoff date. For the latest information, it is recommended to refer to the official documentation and resources provided by Intel (Altera).\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What is the air interface?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The term “air interface” is commonly used in the context of wireless communication systems, particularly in mobile and cellular networks. It refers to the wireless communication link or channel that enables the exchange of data, voice, or other information between a user’s device (such as a smartphone, tablet, or laptop) and the cellular base station or access point.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The air interface is essentially the physical medium through which wireless signals propagate between the user equipment and the network infrastructure. It is also known as the radio interface, as it involves the transmission and reception of radio frequency (RF) signals.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>In cellular networks, such as GSM (Global System for Mobile Communications), CDMA (Code Division Multiple Access), LTE (Long-Term Evolution), and 5G, the air interface plays a crucial role in establishing a wireless link and managing the communication between mobile devices and the network. Different air interface technologies have different modulation schemes, multiple access methods, and protocols to optimize data transmission, coverage, and capacity.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>For example, in a 4G LTE network, the LTE air interface uses Orthogonal Frequency Division Multiplexing (OFDM) for downlink data transmission and Single Carrier Frequency Division Multiple Access (SC-FDMA) for uplink data transmission. These modulation schemes and access methods allow efficient utilization of the available spectrum and enable high-speed data transfer.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>With the evolution of wireless technology, the air interface has continuously improved to accommodate higher data rates, lower latency, better coverage, and increased capacity. The latest generation of mobile networks, 5G (fifth generation), introduces new air interface technologies such as millimeter-wave frequencies, massive MIMO (Multiple-Input Multiple-Output), and beamforming, among others, to provide enhanced performance and support various use cases, including augmented reality, virtual reality, IoT (Internet of Things), and ultra-reliable low-latency communications.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>In summary, the air interface is the wireless communication link that facilitates the exchange of information between user devices and the cellular network, enabling seamless mobile communication and data transfer.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>How is it quoted by the record number?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>(1) In each EF supporting a linear structure, when adding or writing, the record numbers should be assigned in order, that is, in the order of creation.The first record (record number is l) is the record that was first created.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What are the tests for measuring the core air flow sensor?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The core air flow sensor, also known as a mass airflow sensor (MAF sensor), is a critical component in modern automobile engines. It measures the amount of air entering the engine, allowing the engine control unit (ECU) to adjust the fuel injection and ignition timing for optimal performance and fuel efficiency. Several tests can be conducted to measure and diagnose the performance of the core air flow sensor:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Visual Inspection: Start with a visual inspection of the sensor and its connecting wires for any signs of physical damage, contamination, or loose connections.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>MAF Sensor Voltage Check: Use a multimeter to measure the voltage output of the MAF sensor at different engine operating conditions, such as at idle, at various RPMs, and under load. Compare the readings to the manufacturer’s specifications.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Air Flow Measurement Test: Use a flow bench or air flow meter to measure the actual air flow through the sensor. Compare the measured values to the expected air flow for given engine operating conditions.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>On-Vehicle Testing: Connect a scan tool or diagnostic tool to the vehicle’s OBD-II (On-Board Diagnostics) port to access live data from the MAF sensor. Monitor the MAF sensor readings while the engine is running at different RPMs and loads.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Output Frequency Test: Some MAF sensors output a frequency signal rather than a voltage. In this case, use an oscilloscope to measure the frequency of the sensor’s output and verify it against the expected values.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Temperature Compensation Test: Check if the MAF sensor compensates for changes in ambient air temperature. Use a heat source to raise the sensor’s temperature, and observe if the output values change accordingly.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Cleaning Test: If the MAF sensor is suspected to be contaminated, consider cleaning it with a specialized MAF sensor cleaner. After cleaning, repeat the voltage check or on-vehicle testing to observe any improvement in performance.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Comparison with MAP Sensor: In some cases, a comparison between the MAF sensor’s readings and the readings of the Manifold Absolute Pressure (MAP) sensor can be performed to cross-verify the air flow measurements.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>It’s essential to follow the manufacturer’s recommended testing procedures and refer to the vehicle’s service manual for specific testing and diagnostic guidelines. If the MAF sensor is found to be faulty, it’s typically recommended to replace it with a new or OEM-quality sensor to ensure accurate air flow measurement and proper engine performance.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What are the features of the UART?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>UART (Universal Asynchronous Receiver/Transmitter) is a popular hardware communication interface used for serial communication between devices. It is widely used in various applications to enable data exchange between microcontrollers, computers, and other electronic devices. The features of UART include:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Asynchronous Communication: UART is an asynchronous communication protocol, which means that the data is transmitted without a shared clock signal between the sender and receiver. Instead, both the sender and receiver agree on a specific baud rate, which determines the speed of data transmission.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Serial Data Transfer: UART communicates serially, transmitting and receiving data one bit at a time over a single data line. Data is framed by a start bit, followed by the actual data bits (usually 8 bits), an optional parity bit for error checking, and one or more stop bits to signal the end of the data.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Simple Hardware Implementation: UART is relatively straightforward to implement in hardware and is commonly found in microcontrollers and other embedded systems. It requires minimal external components, typically just a few resistors and capacitors.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Full Duplex Communication: UART supports full-duplex communication, allowing simultaneous transmission and reception of data. It uses separate data lines for transmitting (TX) and receiving (RX) data.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Baud Rate Flexibility: The baud rate, which represents the number of bits transmitted per second, can be adjusted to match the communication speed requirements of the devices. Common baud rates range from a few hundred bits per second (bps) to several megabits per second (Mbps).\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Hardware Flow Control: UART supports hardware flow control using additional control lines (RTS/CTS) to prevent data overflows in cases where the transmitting device is sending data faster than the receiving device can process.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Software Flow Control: In addition to hardware flow control, UART also supports software flow control using special characters (XON and XOFF) sent within the data stream to pause or resume data transmission.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Compatibility: UART is widely supported across various platforms and devices, making it an industry-standard communication interface.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Point-to-Point Communication: UART is typically used for point-to-point communication between two devices. For communication between multiple devices, additional protocols like RS-485 or RS-232 with multi-point capability are used.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>The simplicity, flexibility, and widespread support of UART make it a popular choice for many applications requiring reliable and straightforward serial communication.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003Cstrong>What are the characteristics of LD0?\u003C/strong>\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>LD0 features low cost, small package size, low peripheral components and low noise.\u003C/p>","Electronic","uploads/2023/01/01-1-650x303.png",1776793310000,"20db6653d7e85fded62",0,"Admin","2028706543895019522","309ae2b657eb20a1b58","ten-daily-electronic-common-sense-section-163",225,1,"/uploads/2023/01/01-1-650x303.png","Apr 22, 2026",[23,33,42,50,60,69],{"id":24,"title":25,"summary":26,"content":27,"cover":28,"cateId":12,"tags":28,"views":29,"isTop":13,"status":19,"createBy":28,"createTime":30,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":32,"siteId":15},"c047d1a580d380475ed","What are the development tools for supporting 2802x-based applications?","What are the development tools for supporting 2802x-based applications? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">What are the development tools for supporting 2802x-based applications?\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">● CodeComposerStudi0 integrated development environment IDE – c / c compiler A code generation tool An assembler / linker One cycle accurate simulator \u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">● Application algorithm · \u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">",null,238,"2026-04-22 01:44:14","2026-04-22 14:58:27","what-are-the-development-tools-for-supporting-2802x-based-applications",{"id":34,"title":35,"summary":36,"content":37,"cover":28,"cateId":12,"tags":38,"views":39,"isTop":13,"status":19,"createBy":28,"createTime":40,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":41,"siteId":15},"6d16643f4061eb43174","What is the thermocouple sensor made of?","What is the thermocouple sensor made of? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">What is the thermocouple sensor made of?\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">\u003Cspan style=\"font-family: trebuchet-ms;\">A thermocouple sensor is a thermal sensor that uses thermoelectric phenomena.\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003Cbr />\r\n\u003C/span>\u003C/p>","sensor",229,"2026-04-22 01:43:58","what-is-the-thermocouple-sensor-made-of",{"id":43,"title":44,"summary":45,"content":46,"cover":28,"cateId":12,"tags":47,"views":48,"isTop":13,"status":19,"createBy":28,"createTime":40,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":49,"siteId":15},"61750966158705a45ac","What is the goal of software design for terminal nodes?","What is the goal of software design for terminal nodes? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">What is the goal of software design for terminal nodes?\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">Data acquisition of analog input and digital input through C language, that is, collecting parameters from electrical equipment in power grid and substation, and classifying data to master the operation status of the substation and the status of electrical equipment in the station;The command, the jump switch, to achieve the purpose of monitoring and control.\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003Cbr />\r\n\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","design,terminal",224,"what-is-the-goal-of-software-design-for-terminal-nodes",{"id":51,"title":52,"summary":53,"content":54,"cover":55,"cateId":12,"tags":28,"views":56,"isTop":13,"status":19,"createBy":28,"createTime":57,"updateBy":28,"updateTime":58,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":59,"siteId":15},"a39a5d8553e41a5005a","Template Analysis Method For EMC Problems","Template Analysis Method For EMC Problems Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"198\">\r\n\u003Cp>\u003Cdiv id=\"attachment_5001\" style=\"width: 265px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-5001\" decoding=\"async\" class=\" wp-image-5001\" src=\"uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg\" alt=\"\" width=\"255\" height=\"143\" srcset=\"uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg 400w, uploads/2019/10/Forms-of-electromagnetic-interference-250x140.jpg 250w, uploads/2019/10/Forms-of-electromagnetic-interference-150x84.jpg 150w, uploads/2019/10/Forms-of-electromagnetic-interference.jpg 640w\" sizes=\"(max-width: 255px) 100vw, 255px\" />\u003Cp id=\"caption-attachment-5001\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The form of electromagnetic interference\u003C/span>\u003C/p>\u003C/div>\u003C/td>\r\n\u003Ctd width=\"425\">\r\n\u003Cp>\u003Cdiv id=\"attachment_5004\" style=\"width: 376px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-5004\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-5004\" src=\"uploads/2019/10/The-main-form-of-electromagnetic-interference-400x182.jpg\" alt=\"\" width=\"366\" height=\"166\" srcset=\"uploads/2019/10/The-main-form-of-electromagnetic-interference-400x182.jpg 400w, uploads/2019/10/The-main-form-of-electromagnetic-interference-250x114.jpg 250w, uploads/2019/10/The-main-form-of-electromagnetic-interference-150x68.jpg 150w, uploads/2019/10/The-main-form-of-electromagnetic-interference.jpg 562w\" sizes=\"(max-width: 366px) 100vw, 366px\" />\u003Cp id=\"caption-attachment-5004\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The main form of electromagnetic interference\u003C/span>\u003C/p>\u003C/div>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The electromagnetic interference problem is a key issue in any hardware design field. It is especially important to understand the initial dry electromagnetic interference problem to solve this problem.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>The electromagnetic interference model has three basic elements:\u003C/strong>\u003C/span>\u003C/p>\r\n\u003Col>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is electromagnetic interference energy.\u003C/span>\u003C/li>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is a device that is subject to electromagnetic interference.\u003C/span>\u003C/li>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is a coupling channel to transmit electromagnetic energy between the interfered and interfered devices.\u003C/span>\u003C/li>\r\n\u003C/ol>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Electromagnetic interference only occurs when these three basic elements are met at the same time. EMC engineers should determine the EMC design content and design direction based on the physical structure.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The EMC analysis template is determined by the electrical length of the structure. Converting the physical dimensions of the device structure to electrical length is the starting point for design and problem finding. The combination and connection of templates constitute a model for analyzing electromagnetic compatibility problems. The template analysis method is to select the appropriate template and electromagnetic logic connection according to the actual problem and structure to form a dynamic process of complete electromagnetic interference phenomenon.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The EMC design of printed circuit boards is the cheapest and most effective way to eliminate the main sources of RF interference. When the interference source on the printed circuit board and the victim device exist in the same small space, the engineer must control the electromagnetic energy generated. This means that electromagnetic energy is only present at the required assembly parts. This is the method of removing EMC problems, electromagnetic suppression or electromagnetic cancellation.\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg",498,"2026-04-22 01:43:54","2026-04-22 14:58:28","template-analysis-method-for-emc-problems",{"id":61,"title":62,"summary":63,"content":64,"cover":65,"cateId":12,"tags":28,"views":66,"isTop":13,"status":19,"createBy":28,"createTime":67,"updateBy":28,"updateTime":58,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":68,"siteId":15},"86325bcdfe62f25cc0b","Judgment Method of Three Types of Amplifiers","Judgment Method of Three Types of Amplifiers Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Triode based audio and electronic amplifiers are very commonly found in many walks of life. Although, the transistor based amplifiers created the danger of obsolescence of tube amplifiers, the tube amplifiers have succeeded in maintaining a cult following amongst the audiophiles. The main reason behind this is the warm and crunchy sound response of tube amplifiers.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The main component in tube amplifiers is the triode. Triode is essentially an amplifying vacuum tube which consists of three electrodes inside a glass casing. The electrodes are known as anode, cathode, and grid respectively. Triodes were widely used in all types of electronic circuits until they got replaced by transistors. [\u003Ca href=\"#Lee19\">1\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">According to the electronic circuit configuration, there are three main types of amplifiers. These types include common emitter, common collector, and common base amplifiers. Following sub-sections provide an ample discussion on these amplifier types.\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"ez-toc-container\" class=\"ez-toc-v2_0_69_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\r\n\u003Cdiv class=\"ez-toc-title-container\">\r\n\u003Cp class=\"ez-toc-title \" >Table of Contents\u003C/p>\r\n\u003Cspan class=\"ez-toc-title-toggle\">\u003Ca href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\">\u003Cspan class=\"ez-toc-js-icon-con\">\u003Cspan class=\"\">\u003Cspan class=\"eztoc-hide\" style=\"display:none;\">Toggle\u003C/span>\u003Cspan class=\"ez-toc-icon-toggle-span\">\u003Csvg style=\"fill: #999;color:#999\" xmlns=\"http://www.w3.org/2000/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\">\u003Cpath d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\">\u003C/path>\u003C/svg>\u003Csvg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http://www.w3.org/2000/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\">\u003Cpath d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"/>\u003C/svg>\u003C/span>\u003C/span>\u003C/span>\u003C/a>\u003C/span>\u003C/div>\r\n\u003Cnav>\u003Cul class='ez-toc-list ez-toc-list-level-1 ' >\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-1\" href=\"#Common_Emitter_Amplifier\" title=\"Common Emitter Amplifier\">Common Emitter Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-2\" href=\"#Common_Collector_Amplifier\" title=\"Common Collector Amplifier\">Common Collector Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-3\" href=\"#Common_Base_Amplifier\" title=\"Common Base Amplifier\">Common Base Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-4\" href=\"#Works_Cited\" title=\"Works Cited\">Works Cited\u003C/a>\u003C/li>\u003C/ul>\u003C/nav>\u003C/div>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Emitter_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Emitter Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Common emitter amplifiers are the most widely used type of amplifiers. Common emitter amplifiers can be identified easily by the grounded emitter terminal. Like all other amplifiers, the CE amplifier also operates on an AC input. The common emitter amplifier is a single-stage amplifier which uses a BJT transistor or a triode as an amplifying element. The circuit of common emitter amplifier is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4685\" style=\"width: 670px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-4685\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-4685\" src=\"uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg\" alt=\"\" width=\"660\" height=\"512\" srcset=\"uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg 387w, uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit-250x194.jpg 250w, uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit-150x116.jpg 150w\" sizes=\"(max-width: 660px) 100vw, 660px\" />\u003Cp id=\"caption-attachment-4685\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 1: Common Emitter Amplifier Circuit\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Ca href=\"https://www.elprocus.com/common-emitter-amplifier-circuit-working/\">https://www.elprocus.com/common-emitter-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The resistors R1 and R2 form a voltage divider circuit which is used for biasing the transistor. The resistor R\u003Csub>E \u003C/sub>provides thermal stability to the amplifier. A coupling capacitor is present on the input side of the transistor which filters out DC component from the signal. [\u003Ca href=\"#Tar19\">2\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Major advantages of common emitter amplifier include low input impedance, high output impedance, high power gain, low noise, and high current gain. Main disadvantages of common emitter amplifier include unsuitability for high frequencies, unstable voltage gain, high thermal instability, and high output resistance. The CE amplifiers find their applications in low frequency voltage amplifiers, RF circuits, and low noise amplifiers. [\u003Ca href=\"#Tar19\">2\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Collector_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Collector Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The common collector amplifier can be identified from the grounded collector terminal of the triode or the transistor. The common collector amplifiers are mostly used as buffers in multi-stage amplifier circuits. The CC amplifier circuit is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4686\" style=\"width: 633px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-4686\" decoding=\"async\" class=\" wp-image-4686\" src=\"uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit.jpg\" alt=\"\" width=\"623\" height=\"509\" srcset=\"uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit.jpg 329w, uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit-250x204.jpg 250w, uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit-150x123.jpg 150w\" sizes=\"(max-width: 623px) 100vw, 623px\" />\u003Cp id=\"caption-attachment-4686\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 2 Common Collector Amplifier or Emitter Follower Circuit\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\"> \u003Ca href=\"https://www.elprocus.com/common-collector-amplifier-circuit-working/\">https://www.elprocus.com/common-collector-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The input signal is introduced via the base of the triode whereas the output is taken from the emitter terminal. The main advantages of CC amplifier include high current gain, high input resistance, and low output resistance. The disadvantages of CC amplifier include low voltage gain. The CC amplifiers find their applications as impedance matching amplifiers, isolation amplifiers, and buffer amplifiers in cascade or multi-stage amplifier systems. [\u003Ca href=\"#Dav19\">3\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Base_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Base Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The common base amplifier configuration is not as widely used as the CE and CC amplifiers. They are mostly used in high frequency circuits. In a common base amplifier the base terminal of the triode is connected to the ground, the input signal is applied to the emitter, and the output is taken from the collector terminal. The circuit diagram of the CB amplifier is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4687\" style=\"width: 688px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-4687\" decoding=\"async\" class=\" wp-image-4687\" src=\"uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor.png\" alt=\"\" width=\"678\" height=\"835\" srcset=\"uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor.png 194w, uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor-150x185.png 150w\" sizes=\"(max-width: 678px) 100vw, 678px\" />\u003Cp id=\"caption-attachment-4687\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 3 Common Base Amplifier using an NPN Transistor\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Ca href=\"https://www.electronics-tutorials.ws/amplifier/common-base-amplifier.html\">https://www.electronics-tutorials.ws/amplifier/common-base-amplifier.html\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The CB amplifiers are used in high frequency circuits where low input impedance is required. They are used in applications such as moving coil microphone pre-amplifiers, UHF, VHF, and RF amplifiers. The advantages of CB amplifier include decent voltage gain and current buffering capability. The disadvantages include need for dual power supply, low input impedance, low current gain, and high output impedance. [\u003Ca href=\"#www19\">4\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Works_Cited\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Works Cited\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Ctable width=\"630\">\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[1]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Lee Forest. (2019, August) www.allaboutcircuits.com. [Online]. \u003Ca href=\"https://www.allaboutcircuits.com/textbook/semiconductors/chpt-13/the-triode/\">https://www.allaboutcircuits.com/textbook/semiconductors/chpt-13/the-triode/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[2]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Tarun Agarwal. (2019, June) www.elprocus.com. [Online]. \u003Ca href=\"https://www.elprocus.com/common-emitter-amplifier-circuit-working/\">https://www.elprocus.com/common-emitter-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[3]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Dave Moldenhauer. (2019, March) www.watelectrical.com. [Online]. \u003Ca href=\"https://www.watelectrical.com/working-and-applications-of-common-collector-amplifier/\">https://www.watelectrical.com/working-and-applications-of-common-collector-amplifier/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[4]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">(2019, August) www.electronics-notes.com. [Online]. \u003Ca href=\"https://www.electronics-notes.com/articles/analogue_circuits/transistor/transistor-common-base-circuit.php\">https://www.electronics-notes.com/articles/analogue_circuits/transistor/transistor-common-base-circuit.php\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg",56,"2026-04-22 01:43:51","judgment-method-of-three-types-of-amplifiers",{"id":70,"title":71,"summary":72,"content":73,"cover":74,"cateId":12,"tags":28,"views":75,"isTop":13,"status":19,"createBy":28,"createTime":67,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":76,"siteId":15},"4e90914c43b2a6a4366","Precautions for using MOS (Metal-Oxide-Silicon transistor) tubes","Precautions for using MOS (Metal-Oxide-Silicon transistor) tubes Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals & information.","\u003Cdiv id=\"attachment_4675\" style=\"width: 388px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-4675\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-4675\" src=\"uploads/2019/09/MOS-tube.jpg\" alt=\"\" width=\"378\" height=\"378\" srcset=\"uploads/2019/09/MOS-tube.jpg 225w, uploads/2019/09/MOS-tube-150x150.jpg 150w, uploads/2019/09/MOS-tube-24x24.jpg 24w, uploads/2019/09/MOS-tube-48x48.jpg 48w, uploads/2019/09/MOS-tube-96x96.jpg 96w\" sizes=\"(max-width: 378px) 100vw, 378px\" />\u003Cp id=\"caption-attachment-4675\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS tube\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">A MOS transistor (also known as metal-oxide semiconductor field effect transistor) is electrically conductive by a majority of carriers’ and it is a voltage controlled electrical device. It is also called a unipolar transistor. It has three main terminals; Gate (G), Drain (D) and Source (S). The Gate voltage determines the conductivity of the device and with change of applied voltage; the MOS transistor can be used for amplifying or switching electronic signals. Its characteristics are; high input resistance (10^7~10^12Ω), low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown, wide safe working area, source and drain can be interchanged, it is voltage controlled device and conduction takes place through majority carriers (n-channel: electrons and p-channel: holes).\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">All MOS integrated circuits (including P-channel MOS, N-channel MOS, complementary MOS-CMOS integrated circuits) have an insulated gate to prevent voltage breakdown. Generally, the thickness of insulating Gate oxide layer of MOS transistor is 5 – 200 nm (about 25 nm, 50 nm, and 80 nm). In addition to the high-impedance gate of the integrated circuit, there is a resistor-diode network for protection. However, MOS devices are sensitive to voltage spikes and static electricity discharges and this can cause difficulties when we have to replace MOS devices especially complementary-symmetry metal-oxide semiconductor (CMOS) devices. Therefore, the protection network inside the device is not enough to avoid electrostatic damage (ESD) to the device. To minimize chances of damaging MOS devices during handling, special procedures have been developed to protect them from static shock. ICs are generally shipped and stored in special conductive-plastic tubes or trays. MOS devices safety is ensured by inserting ICs leas into aluminium foil or antistatic (conductive) foam – not Styrofoam. PC boards containing static sensitive devices are normally shipped in special antistatic bags, which are good for storing ICs and other computer components that could be damaged by ESD.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Experiments indicate that MOS device will fail during high-voltage discharge. The device may also fail for accumulation of multiple lower voltage discharges. According to the severity of the damage, there are many forms of electrostatic damage. The most serious and most likely to occur is the complete destruction of the input or output so as to be short-circuited or open to the power supply terminal VDD, and MOS device completely loses its original function. A little bit of serious damage is intermittent failure or degradation of performance, which is even more difficult to detect. There is also some electrostatic damage that can cause the device performance to deteriorate due to increased leakage current.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>MOS tube definition\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS tube is a MOS transistor or a metal-insulator-semiconductor. The source (S) and drain (D) of MOS tube can be reversed. They are all N-type regions formed in the P-type backgate. And in most cases, the two zones are same even if two ends are reversed. And it will not affect performance of the device. Such devices are considered to be symmetrical. MOS tube is a voltage-driven high-current type device, which is widely used in circuits, especially power systems. MOS tubes have some characteristics that should be paid special attention in practical applications.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS devices have body diodes formed by pn junction between source (S) and drain (D), and also known as parasitic diodes or an internal diode, are found in a single MOS device between the drain and the source. They are not used in integrated circuit lithography (standard method of printed circuit board (PCB), and microprocessor fabrication). This diode can provide reverse protection and freewheeling during high current drive and inductive loads. The forward voltage drop is about 0.7~1V. Because of this diode, the MOS device can’t simply see the function of a switch in the circuit. For example, in the charging circuit, after the charging is completed, the battery will reverse when the supply power is removed; this is usually the result we do not want to see. The general solution is to add a diode to prevent reverse power supply. This can be done, but the characteristics of the diode must have a forward voltage of 0.6~1V. Down, in the case of high currents, the heat is severe, and at the same time, the energy is wasted, and the energy efficiency of the whole machine is low. Another method is to add a back-to-back MOS tube and use the low on-resistance of the MOS tube to achieve energy saving. Another common application of this characteristic is low-voltage synchronous rectification. In practice, the body diode is a result of manufacturing process, and it is in between the source and drain and on an n-channel device, if the drains fall below voltage on the source, current will flow from source to drain.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>Precautions\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">After the MOS tube is turned on, it has no directionality and in this state of operation, it behaves like a wire. It has a resistance characteristic only and there is no conduction voltage drop in this case. Usually, the saturation level on resistance is several to several tens of milliohms (mΩ). MOS tube is also non-directional therefore allowing both DC and AC currents to pass through.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>Precautions for using MOS tubes\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In order to safely use the MOS tube, the limit value of the dissipated power of the tube, the maximum drain-source voltage, the maximum gate-source voltage, and the maximum current set values cannot be exceeded in the manufacturing design.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When using various types of MOS tubes, they must be connected to the circuit in strict accordance with the required bias, and the polarity of the MOS tube bias should be observed. For example, the junction between the source and drain of the junction MOS transistor is a PN junction, the gate of the N-channel transistor can be positively biased; the gate of the P-channel transistor can be negatively biased.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Since the input impedance of the MOS tube is extremely high, the lead pin must be short-circuited during transportation and storage, and the metal shield package should be used to prevent the external induced potential from penetrating the gate. In particular, it is important to note that the MOS tube cannot be placed in a plastic box. It should be placed in a metal box e.g aluminium foil when it is stored, and the tube should be protected from moisture.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In order to prevent the gate breakdown of the MOS tube, all test instruments, worktables, soldering irons, and the circuit itself must be well grounded; when the pins are soldered, the source is soldered first; before being connected to the circuit, All the lead ends of MOS tube are kept short-circuited with each other, and the short-circuit material is removed after soldering; when removing MOS tube from the component holder, the grounding of the human body should be adhered to. The advanced gas-fired electric soldering iron is convenient for soldering MOS tubes and ensures safety. When the power is not turned off, it is absolutely impossible to insert or remove the tubes from the circuit. The above safety measures must be taken care of when using MOS tubes.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When installing the MOS tube, pay attention to the location of the installation to avoid heating elements; to prevent the vibration of MOS tube, it is necessary to fasten MOS tube; when the lead is bent, it should be larger than the root size of 5 mm. Therefore it is important to prevent bending of the pins and causing air leaks.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When using a VMOS tube, a suitable heat sink must be added. Taking VNF306 as an example, the maximum power can reach 30W after it is equipped with a 140×140×4 (mm) heat sink.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">After the multiple MOS tubes are connected in parallel, the high-frequency characteristics of the amplifier are deteriorated due to the corresponding increase in the inter-electrode capacitance and the distributed capacitance and high-frequency parasitic oscillation of the amplifier is easily caused by the feedback. For this reason, the parallel composite MOS tubes generally do not exceed four, and the anti-parasitic oscillation resistors are connected in series to the base or the gate of each tube.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The gate-source voltage of the junction MOS transistor cannot be reversed and can be saved in the open state. When the insulated gate MOS transistor is not used, the electrodes must be short-circuited since its input resistance is very high, so as to avoid an external electric field. The MOS tube is damaged by such action.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When soldering, the soldering iron shell must be equipped with an external grounding wire to prevent damage to MOS tube due to electrification of the soldering iron. For a small amount of soldering, you can also solder the soldering iron after removing the plug or cutting off the power. Especially when soldering insulated gate MOS transistors, they should be soldered in the order of source-drain-gate, and the power should be cut off.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When soldering with 25W soldering iron, it should be fast. If soldering with 45~75W soldering iron, use the tweezers to clamp the root of the pin to help dissipate heat. The junction MOS tube can qualitatively check the quality of the MOS tube by using the table resistance file (check the resistance between the forward and reverse resistance of each PN junction and the drain source), and the insulated gate field effect tube cannot be inspected with a multimeter, and the tester must be used. Moreover, the short-circuit line of each electrode can be removed after the tester is connected. When it is removed, it should be short-circuited and then removed. The key is to avoid the gate hanging.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When input impedance is a factor to consider during design process, it is necessary to take moisture-proof measures to avoid lowering the input resistance of the MOS tube due to temperature influence. If a four-lead MOS transistor is used, its substrate leads should be grounded. The ceramic packaged of the MOS tube has photosensitive properties and should be protected from light.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">For power MOS tubes, there must be good heat dissipation conditions. Because the power MOS tube is used under high load conditions, it is necessary to design a sufficient heat sink to ensure that the temperature of MOS tube casing does not exceed the rated value, so that the MOS device can work stably and reliably for a long time.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In short, to ensure use of MOS tubes safely, there are many precautions to be adhered to, and the safety measures adopted are various. The vast number of professional and technical personnel required, especially the vast number of electronic enthusiasts, must proceed according to their actual conditions. Take practical measures to use MOS tubes safely and effectively.\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/09/MOS-tube.jpg",146,"precautions-for-using-mos-metal-oxide-silicon-transistor-tubes",1776841284551]