[{"data":1,"prerenderedAt":77},["ShallowReactive",2],{"post-bd0068fcbfe50cc4f71":3,"recom-bd0068fcbfe50cc4f71":22},{"summary":4,"updateTime":5,"title":6,"cateName":7,"content":8,"tags":9,"cover":10,"createTime":11,"cateId":12,"isTop":13,"nickname":14,"siteId":15,"id":16,"isPage":13,"slug":17,"views":18,"status":19,"uid":16,"coverImageUrl":20,"createDate":21,"cate":12,"keywords":9},"Ten Daily Electronic Common Sense-Section-154 Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.",1776841283615,"Ten Daily Electronic Common Sense-Section-154","Tutorials","\u003Cfigure class=\"wp-block-image size-large\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" decoding=\"async\" width=\"650\" height=\"303\" src=\"/uploads/2022/12/01-27-650x303.png\" alt=\"\" class=\"wp-image-14580\" srcset=\"uploads/2022/12/01-27-650x303.png 650w, uploads/2022/12/01-27-400x186.png 400w, uploads/2022/12/01-27-250x117.png 250w, uploads/2022/12/01-27-768x358.png 768w, uploads/2022/12/01-27-150x70.png 150w, uploads/2022/12/01-27-800x373.png 800w, uploads/2022/12/01-27.png 869w\" sizes=\"(max-width: 650px) 100vw, 650px\" />\u003C/figure>\r\n\r\n\r\n\r\n\u003Cdiv id=\"ez-toc-container\" class=\"ez-toc-v2_0_69_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\r\n\u003Cdiv class=\"ez-toc-title-container\">\r\n\u003Cp class=\"ez-toc-title \" >Table of Contents\u003C/p>\r\n\u003Cspan class=\"ez-toc-title-toggle\">\u003Ca href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\">\u003Cspan class=\"ez-toc-js-icon-con\">\u003Cspan class=\"\">\u003Cspan class=\"eztoc-hide\" style=\"display:none;\">Toggle\u003C/span>\u003Cspan class=\"ez-toc-icon-toggle-span\">\u003Csvg style=\"fill: #999;color:#999\" xmlns=\"http://www.w3.org/2000/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\">\u003Cpath d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\">\u003C/path>\u003C/svg>\u003Csvg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http://www.w3.org/2000/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\">\u003Cpath d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"/>\u003C/svg>\u003C/span>\u003C/span>\u003C/span>\u003C/a>\u003C/span>\u003C/div>\r\n\u003Cnav>\u003Cul class='ez-toc-list ez-toc-list-level-1 ' >\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-1\" href=\"#What_are_the_two_basic_communication_methods_for_serial_communication\" title=\"What are the two basic communication methods for serial communication?\">What are the two basic communication methods for serial communication?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-2\" href=\"#What_is_the_difference_between_active_and_passive_drives\" title=\"What is the difference between active and passive drives?\">What is the difference between active and passive drives?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-3\" href=\"#Increase_the_energy_density_of_EDLC_devicesThere_are_three_main_methods_what_are_they\" title=\"Increase the energy density of EDLC devices.There are three main methods, what are they?\">Increase the energy density of EDLC devices.There are three main methods, what are they?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-4\" href=\"#What_are_the_Virtex_class_chips\" title=\"What are the Virtex class chips?\">What are the Virtex class chips?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-5\" href=\"#The_reset_causes_the_microcontroller_to_quickly_enter_the_initial_state_and_execute_the_program_from_this_stateWhat_are_the_main_effects_of_reset\" title=\"The reset causes the microcontroller to quickly enter the initial state and execute the program from this state.What are the main effects of reset?\">The reset causes the microcontroller to quickly enter the initial state and execute the program from this state.What are the main effects of reset?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-6\" href=\"#What_are_the_applications_of_FPGAs_in_wireless_communication_systems\" title=\"What are the applications of FPGAs in wireless communication systems?\">What are the applications of FPGAs in wireless communication systems?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-7\" href=\"#What_is_the_security_system_of_the_smart_card\" title=\"What is the security system of the smart card?\">What is the security system of the smart card?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-8\" href=\"#What_are_the_functions_of_the_dead_zone_DB_module\" title=\"What are the functions of the dead zone (DB) module?\">What are the functions of the dead zone (DB) module?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-9\" href=\"#What_are_the_commonly_used_low_frequency_tags\" title=\"What are the commonly used low frequency tags?\">What are the commonly used low frequency tags?\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-2'>\u003Ca class=\"ez-toc-link ez-toc-heading-10\" href=\"#How_does_the_cookie_data_move\" title=\"How does the cookie data move?\">How does the cookie data move?\u003C/a>\u003C/li>\u003C/ul>\u003C/nav>\u003C/div>\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_are_the_two_basic_communication_methods_for_serial_communication\">\u003C/span>What are the two basic communication methods for serial communication?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>The two basic communication methods for serial communication are:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Synchronous Serial Communication: In synchronous serial communication, data is transmitted in a continuous stream of bits. A clock signal is used to synchronize the sending and receiving devices. Both the sender and receiver must be synchronized with the same clock signal to ensure accurate data transmission. Synchronous serial communication is typically faster and more reliable than asynchronous serial communication.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Asynchronous Serial Communication: In asynchronous serial communication, data is transmitted as individual characters or bytes with start and stop bits framing each character. Unlike synchronous communication, there is no continuous clock signal to synchronize the devices. Instead, the receiver detects the start and stop bits to determine the boundaries of each character. Asynchronous serial communication is commonly used for lower data rates and simpler communication setups.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Both synchronous and asynchronous serial communication methods have their advantages and are used in different applications based on factors such as data rate, complexity, and reliability requirements.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_is_the_difference_between_active_and_passive_drives\">\u003C/span>What is the difference between active and passive drives?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>In the context of electronics or mechanical systems, the terms &#8220;active drive&#8221; and &#8220;passive drive&#8221; refer to different methods of controlling or powering a device. Here&#8217;s an explanation of the difference between the two:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Active Drive: Active drive refers to a system where an external power source actively supplies energy to drive or control a device. The active drive source actively generates and provides the necessary power or signals required for the device&#8217;s operation. It typically involves the use of active components such as transistors, amplifiers, or power sources to deliver the required energy. Active drives are capable of actively manipulating and controlling the behavior of the driven device.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Col start=\"2\">\r\n\u003Cli>Passive Drive: Passive drive, on the other hand, relies on external forces or energies without actively providing power or control signals. It utilizes passive components that do not actively amplify or generate power but rather respond to and utilize existing energies or signals. Passive drives often involve the transfer or conversion of energy from one form to another.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Examples of passive drive include a windmill or water wheel being driven by wind or water currents to produce mechanical energy, or a simple resistor-capacitor (RC) circuit that relies on the charging and discharging of the capacitor using existing signals.In summary, active drives actively generate or provide power to drive and control a device, while passive drives utilize existing energies or signals without actively generating power.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"Increase_the_energy_density_of_EDLC_devicesThere_are_three_main_methods_what_are_they\">\u003C/span>Increase the energy density of EDLC devices.There are three main methods, what are they?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>To increase the energy density of Electric Double Layer Capacitor (EDLC) devices, there are three main methods commonly employed:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Electrode Material Optimization: One approach is to optimize the materials used for the electrodes in EDLCs. The energy density of an EDLC is directly influenced by the specific surface area of the electrode materials. Increasing the specific surface area allows for more effective ion adsorption, leading to higher energy storage capacity. Researchers have been exploring various high-surface-area materials such as carbon nanotubes, graphene, activated carbon, and other nanomaterials to enhance the energy density of EDLCs.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Electrolyte Optimization: The choice of electrolyte also plays a crucial role in improving the energy density of EDLCs. The electrolyte facilitates ion transport between the electrodes, affecting the capacitance and energy storage capabilities. By optimizing the composition and properties of the electrolyte, such as using higher-concentration electrolytes or ionic liquids, researchers aim to enhance the charge storage capacity and overall energy density of the EDLC device.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Device Architecture and Engineering: Another method involves optimizing the overall device architecture and engineering. This includes improving the design and configuration of the EDLC, such as electrode arrangement, separator materials, and cell configuration. For example, using asymmetric electrode configurations, where one electrode has a larger surface area, can enhance the energy density. Additionally, advancements in manufacturing techniques, such as electrode patterning and 3D structures, have shown promise in increasing the energy density of EDLC devices.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>These methods are continuously researched and developed to improve the energy density of EDLCs, making them more competitive with other energy storage technologies.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_are_the_Virtex_class_chips\">\u003C/span>What are the Virtex class chips?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cfigure class=\"wp-block-image size-large\">\u003Cimg decoding=\"async\" width=\"650\" height=\"403\" src=\"/uploads/2023/06/QQ截图20230608112436-650x403.jpg\" alt=\"\" class=\"wp-image-14782\" srcset=\"uploads/2023/06/QQ截图20230608112436-650x403.jpg 650w, uploads/2023/06/QQ截图20230608112436-400x248.jpg 400w, uploads/2023/06/QQ截图20230608112436-250x155.jpg 250w, uploads/2023/06/QQ截图20230608112436-768x476.jpg 768w, uploads/2023/06/QQ截图20230608112436-150x93.jpg 150w, uploads/2023/06/QQ截图20230608112436-800x496.jpg 800w, uploads/2023/06/QQ截图20230608112436.jpg 803w\" sizes=\"(max-width: 650px) 100vw, 650px\" />\u003C/figure>\r\n\r\n\r\n\r\n\u003Cp>Virtex is a series of field-programmable gate array (FPGA) chips developed by Xilinx, a leading manufacturer of programmable logic devices. The Virtex family of chips is known for its high-performance capabilities and versatility, making them suitable for a wide range of applications.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>The Virtex FPGA chips offer a combination of configurable logic blocks, embedded memory, digital signal processing (DSP) capabilities, and high-speed serial transceivers. They are designed to provide flexible and reconfigurable hardware solutions, allowing designers to implement complex digital circuits and systems.The Virtex family has gone through several generations of advancements, with each generation introducing new features and improvements. Some of the notable Virtex chip families include:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Virtex-7: The Virtex-7 family was one of the most recent generations (prior to my knowledge cutoff in September 2021). It offered high-performance FPGAs with advanced features such as high-speed serial transceivers, improved DSP capabilities, and significant logic capacity.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Virtex UltraScale and UltraScale+: The UltraScale and UltraScale+ families are subsequent generations of Virtex chips, offering even higher performance, improved power efficiency, and enhanced functionality. These chips incorporate advanced technologies such as 3D stacked silicon interconnects, fine-grained programmable interconnects, and heterogeneous system integration.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Virtex-6, Virtex-5, and earlier generations: These earlier Virtex families also provided high-performance FPGA solutions and were widely used in various industries and applications.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>It&#8217;s worth noting that Xilinx, the manufacturer of Virtex chips, was acquired by Advanced Micro Devices (AMD) in 2020. As a result, the future developments and product roadmap for the Virtex family may be subject to changes influenced by AMD&#8217;s strategies and priorities.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"The_reset_causes_the_microcontroller_to_quickly_enter_the_initial_state_and_execute_the_program_from_this_stateWhat_are_the_main_effects_of_reset\">\u003C/span>The reset causes the microcontroller to quickly enter the initial state and execute the program from this state.What are the main effects of reset?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>The main effects of a reset on a microcontroller are as follows:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Program Counter (PC) Reset: The program counter, which keeps track of the memory address of the next instruction to be executed, is typically reset to the initial address. This causes the microcontroller to start executing the program from the beginning, as if it were powering up for the first time.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Registers Reset: Depending on the microcontroller architecture, certain registers may be cleared or initialized to their default values during a reset. This ensures a known and consistent starting state for the execution of the program.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Peripherals Reset: In some microcontrollers, a reset can also affect the state of various peripheral modules integrated within the microcontroller. These peripherals may be reset, re-initialized, or put into a default state, depending on the specific microcontroller design.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Timers and Counters Reset: Resetting a microcontroller often includes resetting any timers or counters that may be in use. This clears their current values and restarts them from the beginning.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>I/O Pins Configuration: Some microcontrollers may reset the configuration of input/output (I/O) pins to a default state. This ensures that the pins are not in any unintended state at the start of the program.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Power-On Reset (POR) Circuit: Many microcontrollers have a dedicated Power-On Reset (POR) circuit that generates a reset signal when power is initially applied to the device. This POR circuit ensures a controlled and predictable startup state for the microcontroller.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>Resetting a microcontroller is commonly used to initiate a clean and predictable system state, allowing the program to start execution from a known starting point. It helps to handle unexpected conditions, recover from errors, or perform system initialization tasks when necessary.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_are_the_applications_of_FPGAs_in_wireless_communication_systems\">\u003C/span>What are the applications of FPGAs in wireless communication systems?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>FPGAs (Field-Programmable Gate Arrays) find a range of applications in wireless communication systems due to their flexibility, high processing power, and ability to implement complex digital logic. Here are some common applications of FPGAs in wireless communication:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Baseband Processing: FPGAs are widely used for baseband processing in wireless communication systems. They can handle tasks such as modulation and demodulation, error correction coding and decoding, channel estimation, equalization, and filtering. The reconfigurable nature of FPGAs allows for efficient implementation of these signal processing algorithms, enabling real-time data processing in wireless systems.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Wireless Protocols: FPGAs are used to implement various wireless communication protocols, such as Wi-Fi (IEEE 802.11), cellular standards (e.g., 3G, 4G/LTE, 5G), Bluetooth, Zigbee, and more. FPGAs offer the flexibility to adapt and update these protocols as standards evolve, making them suitable for software-defined radio (SDR) applications.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Digital Front-End (DFE): FPGAs can be employed for implementing the digital front-end of wireless transceivers. This includes functions like digital upconversion, digital downconversion, quadrature modulation/demodulation, synchronization, and carrier frequency recovery. FPGAs allow for the efficient integration of these functions into a single chip, reducing the need for external components.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Multiple-Input Multiple-Output (MIMO) Systems: MIMO techniques are widely used in wireless communication to enhance data throughput and link reliability. FPGAs can be utilized to implement MIMO signal processing algorithms, such as MIMO channel estimation, beamforming, and spatial multiplexing, enabling efficient utilization of multiple antennas at both transmitter and receiver ends.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Software-Defined Radio (SDR): FPGAs are well-suited for SDR platforms, where the radio functionality can be implemented and reconfigured in software. FPGAs enable the flexibility to support multiple wireless standards, dynamic spectrum access, and waveform adaptation, making them ideal for software-defined radio applications.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Test and Measurement: FPGAs are used in wireless test and measurement equipment to generate and analyze signals. They can implement signal generators, digital signal analyzers, and protocol-specific testing functions, enabling efficient characterization, testing, and validation of wireless devices and systems.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>These are just a few examples of the applications of FPGAs in wireless communication systems. The versatility and programmability of FPGAs make them a valuable tool for implementing complex digital processing tasks in wireless technologies.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_is_the_security_system_of_the_smart_card\">\u003C/span>What is the security system of the smart card?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>The security system of a smart card is designed to protect the confidentiality, integrity, and authenticity of the data stored on the card and to ensure secure transactions. Here are some key elements of a smart card&#8217;s security system:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Physical Security: Smart cards are tamper-resistant and have physical security features to protect against unauthorized access. This includes the use of materials that are difficult to tamper with, such as hard plastic casing, embedded chips, and secure contact points.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Authentication and Encryption: Smart cards employ authentication mechanisms to verify the identity of the card and the cardholder. This typically involves the use of cryptographic algorithms and keys stored on the card. Encryption is used to protect sensitive data during transmission and storage, ensuring that only authorized parties can access and understand the information.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Secure Data Storage: Smart cards have secure memory areas, such as protected memory or secure elements, to store sensitive data, cryptographic keys, and authentication credentials. These memory areas are designed to be resistant to unauthorized access or extraction of data.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>PIN Protection: Smart cards often require a Personal Identification Number (PIN) to be entered by the cardholder as an additional layer of security. The PIN acts as a password and is used to authenticate the cardholder&#8217;s identity before allowing access to the card&#8217;s functions and data.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Secure Communication Protocols: Smart cards use secure communication protocols to interact with card readers or terminals. These protocols ensure the integrity and confidentiality of the exchanged data and protect against eavesdropping or tampering.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Application Firewall: Smart cards can have an application firewall that isolates different applications and prevents unauthorized access between them. This helps to ensure that one application&#8217;s data cannot be accessed or modified by another application without proper authorization.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Secure Key Management: Smart cards employ secure key management techniques to protect cryptographic keys and ensure their secure generation, storage, and usage. This includes mechanisms for key generation, key diversification, key wrapping, and secure key exchange protocols.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>These security measures collectively provide robust protection against unauthorized access, data theft, and tampering in smart card systems. It&#8217;s important to note that the specific security features and implementations may vary depending on the type of smart card and its intended use (e.g., payment cards, identification cards, access control cards, etc.).\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_are_the_functions_of_the_dead_zone_DB_module\">\u003C/span>What are the functions of the dead zone (DB) module?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>The Dead Zone (DB) module, also known as the Dead Time module, is a component commonly found in motor control systems, particularly in applications involving power electronic devices such as inverters or motor drives. The main function of the Dead Zone module is to introduce a small delay or dead time between the switching of two power devices (such as transistors or MOSFETs) to prevent shoot-through current and improve system reliability. Here are the primary functions of the Dead Zone module:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Shoot-through Prevention: The Dead Zone module ensures that there is a delay or dead time between turning off one power device and turning on the complementary power device in a bridge configuration. This dead time prevents both power devices from conducting simultaneously, which would result in a short circuit or shoot-through current. Shoot-through can cause excessive power dissipation, damage to the power devices, and inefficient operation of the motor control system.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Minimization of Transient Overlaps: During the switching transition of power devices, there may be brief periods where both devices are partially conducting, resulting in transient overlaps. These overlaps can lead to spikes in current or voltage, causing undesirable effects such as increased switching losses, electromagnetic interference (EMI), and motor control instability. The Dead Zone module helps minimize such overlaps by introducing a controlled delay between the switch transitions.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Protection against Voltage Spikes: The Dead Zone module also helps protect against voltage spikes that may occur during switching. By ensuring that both power devices are not simultaneously conducting, it reduces the chances of voltage spikes and the associated stress on the system components.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Improved System Reliability: By preventing shoot-through currents and reducing transient overlaps, the Dead Zone module contributes to improved system reliability and longevity. It helps maintain the integrity of the power devices, reduces stress on the circuit components, and ensures stable and efficient operation of the motor control system.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>The duration of the dead zone or dead time introduced by the module is typically configurable and depends on the specific requirements of the motor control application, the characteristics of the power devices, and the desired system performance.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"What_are_the_commonly_used_low_frequency_tags\">\u003C/span>What are the commonly used low frequency tags?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>Low-frequency (LF) tags are a type of RFID (Radio Frequency Identification) tags that operate at lower frequencies, typically between 125 kHz and 134 kHz. These tags are commonly used in various applications that require close-range identification and tracking. Some commonly used low-frequency tags include:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>LF 125 kHz Tags: LF tags operating at 125 kHz are widely used for access control systems, animal identification, and asset tracking. They are often used in proximity cards and key fobs for building access, where the tag is brought close to a reader for authentication.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>LF 134 kHz Tags: LF tags operating at 134 kHz are utilized in applications such as livestock tracking, pet identification, and industrial asset management. These tags are commonly implanted or attached to animals or objects and can be read by compatible LF readers in close proximity.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>LF Glass Tags: LF glass tags, also known as glass transponders or bio-glass tags, are small cylindrical tags typically enclosed in a biocompatible glass capsule. These tags are commonly used in animal identification, particularly for permanent identification in pets, livestock, and laboratory animals.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>LF Disc Tags: LF disc tags are thin, round tags that are commonly used in applications such as logistics, inventory management, and access control. These tags can be attached to objects or embedded into products for identification and tracking purposes.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>LF Wristband Tags: LF wristband tags are wearable tags designed to be worn on the wrist, commonly used in applications like event management, healthcare, and access control. These tags are convenient for identification and tracking of individuals in various environments.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>It&#8217;s important to note that the specific LF tags used can vary depending on the requirements of the application, the desired read range, the type of objects being tagged, and the compatibility with LF readers and systems.\u003C/p>\r\n\r\n\r\n\r\n\u003Ch2 class=\"wp-block-heading\">\u003Cspan class=\"ez-toc-section\" id=\"How_does_the_cookie_data_move\">\u003C/span>How does the cookie data move?\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h2>\r\n\r\n\r\n\r\n\u003Cp>Cookie data moves through a process that involves several steps and components. Here&#8217;s an overview of how cookie data moves:\u003C/p>\r\n\r\n\r\n\r\n\u003Col>\r\n\u003Cli>Client Request: When a user&#8217;s web browser sends a request to a web server, it includes various headers, including the Cookie header. The Cookie header contains one or more cookies associated with the website or domain being accessed.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Server Response: Upon receiving the client request, the web server processes the request and generates a response. If the server needs to send a cookie to the client, it includes a Set-Cookie header in the response.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Cookie Storage: The web browser receives the server response, including the Set-Cookie header if applicable. The browser then stores the cookie data locally on the user&#8217;s device. The storage mechanism varies based on the browser, but typically the cookies are stored in a cookie file or in-memory storage.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Subsequent Requests: When the user interacts with the website and sends subsequent requests, the browser automatically includes the stored cookies in the Cookie header of each request. This allows the server to identify and authenticate the user, personalize the user&#8217;s experience, or maintain session information.\u003C/li>\r\n\r\n\r\n\r\n\u003Cli>Server Processing: The web server receives subsequent requests from the client, including the Cookie header. It can then access and utilize the cookie data to provide personalized content, remember user preferences, maintain session state, or perform other operations based on the information stored in the cookies.\u003C/li>\r\n\u003C/ol>\r\n\r\n\r\n\r\n\u003Cp>It&#8217;s important to note that cookies are domain-specific and have limitations on their scope. Cookies are typically associated with a specific domain or subdomain, and they are sent to the server only when making requests to that domain or subdomain. Additionally, cookies can have attributes such as expiration date, secure flag (for HTTPS-only communication), and path restrictions, which further define their behavior and usage.Overall, the movement of cookie data involves the exchange of information between the client (web browser) and the server, enabling the server to maintain state and personalize the user&#8217;s browsing experience.\u003C/p>\r\n\r\n\r\n\r\n\u003Cp>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","Electronic","uploads/2022/12/01-27-650x303.png",1776793312000,"20db6653d7e85fded62",0,"Admin","2028706543895019522","bd0068fcbfe50cc4f71","ten-daily-electronic-common-sense-section-154",165,1,"/uploads/2022/12/01-27-650x303.png","Apr 22, 2026",[23,33,42,50,60,69],{"id":24,"title":25,"summary":26,"content":27,"cover":28,"cateId":12,"tags":28,"views":29,"isTop":13,"status":19,"createBy":28,"createTime":30,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":32,"siteId":15},"c047d1a580d380475ed","What are the development tools for supporting 2802x-based applications?","What are the development tools for supporting 2802x-based applications? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">What are the development tools for supporting 2802x-based applications?\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">● CodeComposerStudi0 integrated development environment IDE &#8211; c / c compiler A code generation tool An assembler / linker One cycle accurate simulator \u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">● Application algorithm · \u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">",null,238,"2026-04-22 01:44:14","2026-04-22 14:58:27","what-are-the-development-tools-for-supporting-2802x-based-applications",{"id":34,"title":35,"summary":36,"content":37,"cover":28,"cateId":12,"tags":38,"views":39,"isTop":13,"status":19,"createBy":28,"createTime":40,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":41,"siteId":15},"6d16643f4061eb43174","What is the thermocouple sensor made of?","What is the thermocouple sensor made of? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">What is the thermocouple sensor made of?\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">\u003Cspan style=\"font-family: trebuchet-ms;\">A thermocouple sensor is a thermal sensor that uses thermoelectric phenomena.\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003Cbr />\r\n\u003C/span>\u003C/p>","sensor",229,"2026-04-22 01:43:58","what-is-the-thermocouple-sensor-made-of",{"id":43,"title":44,"summary":45,"content":46,"cover":28,"cateId":12,"tags":47,"views":48,"isTop":13,"status":19,"createBy":28,"createTime":40,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":49,"siteId":15},"61750966158705a45ac","What is the goal of software design for terminal nodes?","What is the goal of software design for terminal nodes? Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva; font-size: 12pt;\">\u003Cspan style=\"color: #c70a0a;\">*\u003C/span> \u003Cspan style=\"color: #808080;\">Question\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">What is the goal of software design for terminal nodes?\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cspan style=\"color: #c70a0a;\">\u003Cbr />\r\n\u003Cspan style=\"font-size: 12pt;\">*\u003C/span>\u003C/span>\u003Cspan style=\"color: #808080; font-size: 12pt;\"> Answer\u003C/span>\u003C/span>\u003C/p>\r\n\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"1136\">Data acquisition of analog input and digital input through C language, that is, collecting parameters from electrical equipment in power grid and substation, and classifying data to master the operation status of the substation and the status of electrical equipment in the station;The command, the jump switch, to achieve the purpose of monitoring and control.\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-size: inherit;\">\u003Cbr />\r\n\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","design,terminal",224,"what-is-the-goal-of-software-design-for-terminal-nodes",{"id":51,"title":52,"summary":53,"content":54,"cover":55,"cateId":12,"tags":28,"views":56,"isTop":13,"status":19,"createBy":28,"createTime":57,"updateBy":28,"updateTime":58,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":59,"siteId":15},"a39a5d8553e41a5005a","Template Analysis Method For EMC Problems","Template Analysis Method For EMC Problems Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Ctable>\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"198\">\r\n\u003Cp>\u003Cdiv id=\"attachment_5001\" style=\"width: 265px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-5001\" decoding=\"async\" class=\" wp-image-5001\" src=\"uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg\" alt=\"\" width=\"255\" height=\"143\" srcset=\"uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg 400w, uploads/2019/10/Forms-of-electromagnetic-interference-250x140.jpg 250w, uploads/2019/10/Forms-of-electromagnetic-interference-150x84.jpg 150w, uploads/2019/10/Forms-of-electromagnetic-interference.jpg 640w\" sizes=\"(max-width: 255px) 100vw, 255px\" />\u003Cp id=\"caption-attachment-5001\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The form of electromagnetic interference\u003C/span>\u003C/p>\u003C/div>\u003C/td>\r\n\u003Ctd width=\"425\">\r\n\u003Cp>\u003Cdiv id=\"attachment_5004\" style=\"width: 376px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-5004\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-5004\" src=\"uploads/2019/10/The-main-form-of-electromagnetic-interference-400x182.jpg\" alt=\"\" width=\"366\" height=\"166\" srcset=\"uploads/2019/10/The-main-form-of-electromagnetic-interference-400x182.jpg 400w, uploads/2019/10/The-main-form-of-electromagnetic-interference-250x114.jpg 250w, uploads/2019/10/The-main-form-of-electromagnetic-interference-150x68.jpg 150w, uploads/2019/10/The-main-form-of-electromagnetic-interference.jpg 562w\" sizes=\"(max-width: 366px) 100vw, 366px\" />\u003Cp id=\"caption-attachment-5004\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The main form of electromagnetic interference\u003C/span>\u003C/p>\u003C/div>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The electromagnetic interference problem is a key issue in any hardware design field. It is especially important to understand the initial dry electromagnetic interference problem to solve this problem.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>The electromagnetic interference model has three basic elements:\u003C/strong>\u003C/span>\u003C/p>\r\n\u003Col>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is electromagnetic interference energy.\u003C/span>\u003C/li>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is a device that is subject to electromagnetic interference.\u003C/span>\u003C/li>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">There is a coupling channel to transmit electromagnetic energy between the interfered and interfered devices.\u003C/span>\u003C/li>\r\n\u003C/ol>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Electromagnetic interference only occurs when these three basic elements are met at the same time. EMC engineers should determine the EMC design content and design direction based on the physical structure.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The EMC analysis template is determined by the electrical length of the structure. Converting the physical dimensions of the device structure to electrical length is the starting point for design and problem finding. The combination and connection of templates constitute a model for analyzing electromagnetic compatibility problems. The template analysis method is to select the appropriate template and electromagnetic logic connection according to the actual problem and structure to form a dynamic process of complete electromagnetic interference phenomenon.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The EMC design of printed circuit boards is the cheapest and most effective way to eliminate the main sources of RF interference. When the interference source on the printed circuit board and the victim device exist in the same small space, the engineer must control the electromagnetic energy generated. This means that electromagnetic energy is only present at the required assembly parts. This is the method of removing EMC problems, electromagnetic suppression or electromagnetic cancellation.\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/10/Forms-of-electromagnetic-interference-400x224.jpg",498,"2026-04-22 01:43:54","2026-04-22 14:58:28","template-analysis-method-for-emc-problems",{"id":61,"title":62,"summary":63,"content":64,"cover":65,"cateId":12,"tags":28,"views":66,"isTop":13,"status":19,"createBy":28,"createTime":67,"updateBy":28,"updateTime":58,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":68,"siteId":15},"86325bcdfe62f25cc0b","Judgment Method of Three Types of Amplifiers","Judgment Method of Three Types of Amplifiers Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Triode based audio and electronic amplifiers are very commonly found in many walks of life. Although, the transistor based amplifiers created the danger of obsolescence of tube amplifiers, the tube amplifiers have succeeded in maintaining a cult following amongst the audiophiles. The main reason behind this is the warm and crunchy sound response of tube amplifiers.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The main component in tube amplifiers is the triode. Triode is essentially an amplifying vacuum tube which consists of three electrodes inside a glass casing. The electrodes are known as anode, cathode, and grid respectively. Triodes were widely used in all types of electronic circuits until they got replaced by transistors. [\u003Ca href=\"#Lee19\">1\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">According to the electronic circuit configuration, there are three main types of amplifiers. These types include common emitter, common collector, and common base amplifiers. Following sub-sections provide an ample discussion on these amplifier types.\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"ez-toc-container\" class=\"ez-toc-v2_0_69_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\r\n\u003Cdiv class=\"ez-toc-title-container\">\r\n\u003Cp class=\"ez-toc-title \" >Table of Contents\u003C/p>\r\n\u003Cspan class=\"ez-toc-title-toggle\">\u003Ca href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\">\u003Cspan class=\"ez-toc-js-icon-con\">\u003Cspan class=\"\">\u003Cspan class=\"eztoc-hide\" style=\"display:none;\">Toggle\u003C/span>\u003Cspan class=\"ez-toc-icon-toggle-span\">\u003Csvg style=\"fill: #999;color:#999\" xmlns=\"http://www.w3.org/2000/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\">\u003Cpath d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\">\u003C/path>\u003C/svg>\u003Csvg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http://www.w3.org/2000/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\">\u003Cpath d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"/>\u003C/svg>\u003C/span>\u003C/span>\u003C/span>\u003C/a>\u003C/span>\u003C/div>\r\n\u003Cnav>\u003Cul class='ez-toc-list ez-toc-list-level-1 ' >\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-1\" href=\"#Common_Emitter_Amplifier\" title=\"Common Emitter Amplifier\">Common Emitter Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-2\" href=\"#Common_Collector_Amplifier\" title=\"Common Collector Amplifier\">Common Collector Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-3\" href=\"#Common_Base_Amplifier\" title=\"Common Base Amplifier\">Common Base Amplifier\u003C/a>\u003C/li>\u003Cli class='ez-toc-page-1 ez-toc-heading-level-1'>\u003Ca class=\"ez-toc-link ez-toc-heading-4\" href=\"#Works_Cited\" title=\"Works Cited\">Works Cited\u003C/a>\u003C/li>\u003C/ul>\u003C/nav>\u003C/div>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Emitter_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Emitter Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Common emitter amplifiers are the most widely used type of amplifiers. Common emitter amplifiers can be identified easily by the grounded emitter terminal. Like all other amplifiers, the CE amplifier also operates on an AC input. The common emitter amplifier is a single-stage amplifier which uses a BJT transistor or a triode as an amplifying element. The circuit of common emitter amplifier is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4685\" style=\"width: 670px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-4685\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-4685\" src=\"uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg\" alt=\"\" width=\"660\" height=\"512\" srcset=\"uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg 387w, uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit-250x194.jpg 250w, uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit-150x116.jpg 150w\" sizes=\"(max-width: 660px) 100vw, 660px\" />\u003Cp id=\"caption-attachment-4685\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 1: Common Emitter Amplifier Circuit\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Ca href=\"https://www.elprocus.com/common-emitter-amplifier-circuit-working/\">https://www.elprocus.com/common-emitter-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The resistors R1 and R2 form a voltage divider circuit which is used for biasing the transistor. The resistor R\u003Csub>E \u003C/sub>provides thermal stability to the amplifier. A coupling capacitor is present on the input side of the transistor which filters out DC component from the signal. [\u003Ca href=\"#Tar19\">2\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Major advantages of common emitter amplifier include low input impedance, high output impedance, high power gain, low noise, and high current gain. Main disadvantages of common emitter amplifier include unsuitability for high frequencies, unstable voltage gain, high thermal instability, and high output resistance. The CE amplifiers find their applications in low frequency voltage amplifiers, RF circuits, and low noise amplifiers. [\u003Ca href=\"#Tar19\">2\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Collector_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Collector Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The common collector amplifier can be identified from the grounded collector terminal of the triode or the transistor. The common collector amplifiers are mostly used as buffers in multi-stage amplifier circuits. The CC amplifier circuit is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4686\" style=\"width: 633px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-4686\" decoding=\"async\" class=\" wp-image-4686\" src=\"uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit.jpg\" alt=\"\" width=\"623\" height=\"509\" srcset=\"uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit.jpg 329w, uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit-250x204.jpg 250w, uploads/2019/09/Figure-2-Common-Collector-Amplifier-or-Emitter-Follower-Circuit-150x123.jpg 150w\" sizes=\"(max-width: 623px) 100vw, 623px\" />\u003Cp id=\"caption-attachment-4686\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 2 Common Collector Amplifier or Emitter Follower Circuit\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\"> \u003Ca href=\"https://www.elprocus.com/common-collector-amplifier-circuit-working/\">https://www.elprocus.com/common-collector-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The input signal is introduced via the base of the triode whereas the output is taken from the emitter terminal. The main advantages of CC amplifier include high current gain, high input resistance, and low output resistance. The disadvantages of CC amplifier include low voltage gain. The CC amplifiers find their applications as impedance matching amplifiers, isolation amplifiers, and buffer amplifiers in cascade or multi-stage amplifier systems. [\u003Ca href=\"#Dav19\">3\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Common_Base_Amplifier\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Common Base Amplifier\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The common base amplifier configuration is not as widely used as the CE and CC amplifiers. They are mostly used in high frequency circuits. In a common base amplifier the base terminal of the triode is connected to the ground, the input signal is applied to the emitter, and the output is taken from the collector terminal. The circuit diagram of the CB amplifier is given as following:\u003C/span>\u003C/p>\r\n\u003Cdiv id=\"attachment_4687\" style=\"width: 688px\" class=\"wp-caption alignnone\">\u003Cimg loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" loading=\"lazy\" aria-describedby=\"caption-attachment-4687\" decoding=\"async\" class=\" wp-image-4687\" src=\"uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor.png\" alt=\"\" width=\"678\" height=\"835\" srcset=\"uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor.png 194w, uploads/2019/09/Figure-3-Common-Base-Amplifier-using-an-NPN-Transistor-150x185.png 150w\" sizes=\"(max-width: 678px) 100vw, 678px\" />\u003Cp id=\"caption-attachment-4687\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Figure 3 Common Base Amplifier using an NPN Transistor\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">\u003Ca href=\"https://www.electronics-tutorials.ws/amplifier/common-base-amplifier.html\">https://www.electronics-tutorials.ws/amplifier/common-base-amplifier.html\u003C/a>\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The CB amplifiers are used in high frequency circuits where low input impedance is required. They are used in applications such as moving coil microphone pre-amplifiers, UHF, VHF, and RF amplifiers. The advantages of CB amplifier include decent voltage gain and current buffering capability. The disadvantages include need for dual power supply, low input impedance, low current gain, and high output impedance. [\u003Ca href=\"#www19\">4\u003C/a>]\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan class=\"ez-toc-section\" id=\"Works_Cited\">\u003C/span>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">Works Cited\u003C/span>\u003Cspan class=\"ez-toc-section-end\">\u003C/span>\u003C/h1>\r\n\u003Ctable width=\"630\">\r\n\u003Ctbody>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[1]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Lee Forest. (2019, August) www.allaboutcircuits.com. [Online]. \u003Ca href=\"https://www.allaboutcircuits.com/textbook/semiconductors/chpt-13/the-triode/\">https://www.allaboutcircuits.com/textbook/semiconductors/chpt-13/the-triode/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[2]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Tarun Agarwal. (2019, June) www.elprocus.com. [Online]. \u003Ca href=\"https://www.elprocus.com/common-emitter-amplifier-circuit-working/\">https://www.elprocus.com/common-emitter-amplifier-circuit-working/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[3]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Dave Moldenhauer. (2019, March) www.watelectrical.com. [Online]. \u003Ca href=\"https://www.watelectrical.com/working-and-applications-of-common-collector-amplifier/\">https://www.watelectrical.com/working-and-applications-of-common-collector-amplifier/\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003Ctr>\r\n\u003Ctd width=\"18\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">[4]\u003C/span>\u003C/td>\r\n\u003Ctd width=\"606\">\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">(2019, August) www.electronics-notes.com. [Online]. \u003Ca href=\"https://www.electronics-notes.com/articles/analogue_circuits/transistor/transistor-common-base-circuit.php\">https://www.electronics-notes.com/articles/analogue_circuits/transistor/transistor-common-base-circuit.php\u003C/a>\u003C/span>\u003C/td>\r\n\u003C/tr>\r\n\u003C/tbody>\r\n\u003C/table>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/09/Figure-1-Common-Emitter-Amplifier-Circuit.jpg",56,"2026-04-22 01:43:51","judgment-method-of-three-types-of-amplifiers",{"id":70,"title":71,"summary":72,"content":73,"cover":74,"cateId":12,"tags":28,"views":75,"isTop":13,"status":19,"createBy":28,"createTime":67,"updateBy":28,"updateTime":31,"institutionId":28,"isPage":13,"images":28,"horizontalCover":28,"verticalCover":28,"slug":76,"siteId":15},"4e90914c43b2a6a4366","Precautions for using MOS (Metal-Oxide-Silicon transistor) tubes","Precautions for using MOS (Metal-Oxide-Silicon transistor) tubes Looking for capacitors online purchase? is a reliable marketplace to buy and learn about capacitors. Come with us for amazing deals &amp; information.","\u003Cdiv id=\"attachment_4675\" style=\"width: 388px\" class=\"wp-caption alignnone\">\u003Cimg fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" fetchpriority=\"high\" aria-describedby=\"caption-attachment-4675\" fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-4675\" src=\"uploads/2019/09/MOS-tube.jpg\" alt=\"\" width=\"378\" height=\"378\" srcset=\"uploads/2019/09/MOS-tube.jpg 225w, uploads/2019/09/MOS-tube-150x150.jpg 150w, uploads/2019/09/MOS-tube-24x24.jpg 24w, uploads/2019/09/MOS-tube-48x48.jpg 48w, uploads/2019/09/MOS-tube-96x96.jpg 96w\" sizes=\"(max-width: 378px) 100vw, 378px\" />\u003Cp id=\"caption-attachment-4675\" class=\"wp-caption-text\">\u003C/span> \u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS tube\u003C/span>\u003C/p>\u003C/div>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">A MOS transistor (also known as metal-oxide semiconductor field effect transistor) is electrically conductive by a majority of carriers’ and it is a voltage controlled electrical device. It is also called a unipolar transistor. It has three main terminals; Gate (G), Drain (D) and Source (S). The Gate voltage determines the conductivity of the device and with change of applied voltage; the MOS transistor can be used for amplifying or switching electronic signals. Its characteristics are; high input resistance (10^7~10^12Ω), low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown, wide safe working area, source and drain can be interchanged, it is voltage controlled device and conduction takes place through majority carriers (n-channel: electrons and p-channel: holes).\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">All MOS integrated circuits (including P-channel MOS, N-channel MOS, complementary MOS-CMOS integrated circuits) have an insulated gate to prevent voltage breakdown. Generally, the thickness of insulating Gate oxide layer of MOS transistor is 5 &#8211; 200 nm (about 25 nm, 50 nm, and 80 nm). In addition to the high-impedance gate of the integrated circuit, there is a resistor-diode network for protection. However, MOS devices are sensitive to voltage spikes and static electricity discharges and this can cause difficulties when we have to replace MOS devices especially complementary-symmetry metal-oxide semiconductor (CMOS) devices. Therefore, the protection network inside the device is not enough to avoid electrostatic damage (ESD) to the device. To minimize chances of damaging MOS devices during handling, special procedures have been developed to protect them from static shock. ICs are generally shipped and stored in special conductive-plastic tubes or trays. MOS devices safety is ensured by inserting ICs leas into aluminium foil or antistatic (conductive) foam – not Styrofoam. PC boards containing static sensitive devices are normally shipped in special antistatic bags, which are good for storing ICs and other computer components that could be damaged by ESD.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Experiments indicate that MOS device will fail during high-voltage discharge. The device may also fail for accumulation of multiple lower voltage discharges. According to the severity of the damage, there are many forms of electrostatic damage. The most serious and most likely to occur is the complete destruction of the input or output so as to be short-circuited or open to the power supply terminal VDD, and MOS device completely loses its original function. A little bit of serious damage is intermittent failure or degradation of performance, which is even more difficult to detect. There is also some electrostatic damage that can cause the device performance to deteriorate due to increased leakage current.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>MOS tube definition\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS tube is a MOS transistor or a metal-insulator-semiconductor. The source (S) and drain (D) of MOS tube can be reversed. They are all N-type regions formed in the P-type backgate. And in most cases, the two zones are same even if two ends are reversed. And it will not affect performance of the device. Such devices are considered to be symmetrical. MOS tube is a voltage-driven high-current type device, which is widely used in circuits, especially power systems. MOS tubes have some characteristics that should be paid special attention in practical applications.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">MOS devices have body diodes formed by pn junction between source (S) and drain (D), and also known as parasitic diodes or an internal diode, are found in a single MOS device between the drain and the source. They are not used in integrated circuit lithography (standard method of printed circuit board (PCB), and microprocessor fabrication). This diode can provide reverse protection and freewheeling during high current drive and inductive loads. The forward voltage drop is about 0.7~1V. Because of this diode, the MOS device can&#8217;t simply see the function of a switch in the circuit. For example, in the charging circuit, after the charging is completed, the battery will reverse when the supply power is removed; this is usually the result we do not want to see. The general solution is to add a diode to prevent reverse power supply. This can be done, but the characteristics of the diode must have a forward voltage of 0.6~1V. Down, in the case of high currents, the heat is severe, and at the same time, the energy is wasted, and the energy efficiency of the whole machine is low. Another method is to add a back-to-back MOS tube and use the low on-resistance of the MOS tube to achieve energy saving. Another common application of this characteristic is low-voltage synchronous rectification. In practice, the body diode is a result of manufacturing process, and it is in between the source and drain and on an n-channel device, if the drains fall below voltage on the source, current will flow from source to drain.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>Precautions\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">After the MOS tube is turned on, it has no directionality and in this state of operation, it behaves like a wire. It has a resistance characteristic only and there is no conduction voltage drop in this case. Usually, the saturation level on resistance is several to several tens of milliohms (mΩ). MOS tube is also non-directional therefore allowing both DC and AC currents to pass through.\u003C/span>\u003C/p>\r\n\u003Ch1>\u003Cspan style=\"font-size: 14pt; font-family: 'Trebuchet MS', Geneva;\">\u003Cstrong>Precautions for using MOS tubes\u003C/strong>\u003C/span>\u003C/h1>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In order to safely use the MOS tube, the limit value of the dissipated power of the tube, the maximum drain-source voltage, the maximum gate-source voltage, and the maximum current set values cannot be exceeded in the manufacturing design.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When using various types of MOS tubes, they must be connected to the circuit in strict accordance with the required bias, and the polarity of the MOS tube bias should be observed. For example, the junction between the source and drain of the junction MOS transistor is a PN junction, the gate of the N-channel transistor can be positively biased; the gate of the P-channel transistor can be negatively biased.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">Since the input impedance of the MOS tube is extremely high, the lead pin must be short-circuited during transportation and storage, and the metal shield package should be used to prevent the external induced potential from penetrating the gate. In particular, it is important to note that the MOS tube cannot be placed in a plastic box. It should be placed in a metal box e.g aluminium foil when it is stored, and the tube should be protected from moisture.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In order to prevent the gate breakdown of the MOS tube, all test instruments, worktables, soldering irons, and the circuit itself must be well grounded; when the pins are soldered, the source is soldered first; before being connected to the circuit, All the lead ends of MOS tube are kept short-circuited with each other, and the short-circuit material is removed after soldering; when removing MOS tube from the component holder, the grounding of the human body should be adhered to. The advanced gas-fired electric soldering iron is convenient for soldering MOS tubes and ensures safety. When the power is not turned off, it is absolutely impossible to insert or remove the tubes from the circuit. The above safety measures must be taken care of when using MOS tubes.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When installing the MOS tube, pay attention to the location of the installation to avoid heating elements; to prevent the vibration of MOS tube, it is necessary to fasten MOS tube; when the lead is bent, it should be larger than the root size of 5 mm. Therefore it is important to prevent bending of the pins and causing air leaks.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When using a VMOS tube, a suitable heat sink must be added. Taking VNF306 as an example, the maximum power can reach 30W after it is equipped with a 140×140×4 (mm) heat sink.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">After the multiple MOS tubes are connected in parallel, the high-frequency characteristics of the amplifier are deteriorated due to the corresponding increase in the inter-electrode capacitance and the distributed capacitance and high-frequency parasitic oscillation of the amplifier is easily caused by the feedback. For this reason, the parallel composite MOS tubes generally do not exceed four, and the anti-parasitic oscillation resistors are connected in series to the base or the gate of each tube.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">The gate-source voltage of the junction MOS transistor cannot be reversed and can be saved in the open state. When the insulated gate MOS transistor is not used, the electrodes must be short-circuited since its input resistance is very high, so as to avoid an external electric field. The MOS tube is damaged by such action.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When soldering, the soldering iron shell must be equipped with an external grounding wire to prevent damage to MOS tube due to electrification of the soldering iron. For a small amount of soldering, you can also solder the soldering iron after removing the plug or cutting off the power. Especially when soldering insulated gate MOS transistors, they should be soldered in the order of source-drain-gate, and the power should be cut off.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cul>\r\n\u003Cli>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When soldering with 25W soldering iron, it should be fast. If soldering with 45~75W soldering iron, use the tweezers to clamp the root of the pin to help dissipate heat. The junction MOS tube can qualitatively check the quality of the MOS tube by using the table resistance file (check the resistance between the forward and reverse resistance of each PN junction and the drain source), and the insulated gate field effect tube cannot be inspected with a multimeter, and the tester must be used. Moreover, the short-circuit line of each electrode can be removed after the tester is connected. When it is removed, it should be short-circuited and then removed. The key is to avoid the gate hanging.\u003C/span>\u003C/li>\r\n\u003C/ul>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">When input impedance is a factor to consider during design process, it is necessary to take moisture-proof measures to avoid lowering the input resistance of the MOS tube due to temperature influence. If a four-lead MOS transistor is used, its substrate leads should be grounded. The ceramic packaged of the MOS tube has photosensitive properties and should be protected from light.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">For power MOS tubes, there must be good heat dissipation conditions. Because the power MOS tube is used under high load conditions, it is necessary to design a sufficient heat sink to ensure that the temperature of MOS tube casing does not exceed the rated value, so that the MOS device can work stably and reliably for a long time.\u003C/span>\u003C/p>\r\n\u003Cp>\u003Cspan style=\"font-family: 'Trebuchet MS', Geneva;\">In short, to ensure use of MOS tubes safely, there are many precautions to be adhered to, and the safety measures adopted are various. The vast number of professional and technical personnel required, especially the vast number of electronic enthusiasts, must proceed according to their actual conditions. Take practical measures to use MOS tubes safely and effectively.\u003C/span>\u003C/p>\r\n\u003C/div>\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">\u003C/div>\r\n\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\u003C!-- clear for photos floats -->\r\n\t\t\t\t\t\t\u003Cdiv class=\"clear\">","uploads/2019/09/MOS-tube.jpg",146,"precautions-for-using-mos-metal-oxide-silicon-transistor-tubes",1776841270713]