What are the methods for dissipating heat and preventing temperature gradients on the PCB?
* Question
| What are the methods for dissipating heat and preventing temperature gradients on the PCB? |
* Answer
| : 1 use several small and economical packages in parallel, but need to separate them on the PCB;
2 separate the driver circuit from the power transistor; 3 use high-performance package IC to achieve good thermal contact with the PCB, heatThe resistance is reduced to a minimum. |
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