A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from June 7th to June 13th, 2024

1. Source: TrendForce – VIS and NXP to Build a 12-Inch Fab

Date: June 7, 2024

Keywords: VIS, NXP

Impacted Products: Semiconductor

Manufacturers: VIS, NXP

Summary: Vanguard International Semiconductor (VIS) and NXP Semiconductors have announced a joint venture to construct a 12-inch semiconductor fabrication plant in Singapore. The $7.8 billion investment aims to boost production capacity, focusing on mixed-signal, power management, and analog products for various markets. The facility, expected to begin mass production by 2027, will strengthen Singapore’s position as a key hub in the global semiconductor industry.

2.Source: Circuit Digest – Zoho Ventures into Chip-making

Date: June 9, 2024

Keywords: Zoho, chip-making

Impacted Products: —

Manufacturers: Zoho

Summary: Zoho, an Indian software firm, has announced a $700 million investment to enter the chip-making business. This move aims to enhance India’s position in the global semiconductor industry and diversify Zoho’s business operations into high-tech manufacturing.

3.Source: Power Electronics – Infineon Unveils CoolMOS™ 8

Date: June 9, 2024

Keywords: Infineon, Silicon MOSFET

Impacted Products: CoolMOS™ 8

Manufacturers: Infineon

Summary: Infineon Technologies introduces the 600 V CoolMOS™ 8, a next-generation silicon MOSFET technology designed to enhance efficiency and performance in power electronics. This innovation is targeted at applications requiring high efficiency, reliability, and compact form factors, such as power supplies and electric vehicles.

4. Source:Power Electronics – CGD Announces GaN Power ICs

Date: June 7, 2024

Keywords: CGD, GaN Power ICs, RDS

Impacted Products: GaN Power ICs

Manufacturers: CGD

Summary: Cambridge GaN Devices (CGD) has introduced new low RDS(on) GaN power ICs, featuring advanced die and packaging technology. These innovations promise enhanced performance and efficiency, targeting applications in power management and energy conversion sectors.

5. Source: SMT Today – Silicon Mountain Offers PCB Coating

Date: June 11, 2024

Keywords: Silicon Mountain, PCB

Impacted Products: PCB

Manufacturers: Silicon Mountain

Summary: Silicon Mountain has introduced conformal coating services to enhance the protection and reliability of printed circuit boards (PCBs). These coatings provide a protective barrier against environmental factors such as moisture, dust, and chemicals, ensuring the longevity and performance of PCBs in harsh conditions.

6. Source:SMT Today – Zollner and Luminovo Set New Standard

Date: June 11, 2024

Keywords: Zollner, Luminovo, digital supply chain, EMS

Impacted Products: Digital supply chain solutions

Manufacturers: All

Summary: Zollner Elektronik AG and Luminovo have collaborated to establish a new benchmark for digital supply chain collaboration in the Electronic Manufacturing Services (EMS) industry. This partnership focuses on enhancing efficiency, transparency, and integration across supply chain operations by utilizing advanced digital tools and platforms.

7. Source: EENews Europe – Intel Launches EV Chip

Date: June 10, 2024

Keywords: Intel, EV chip, integrated circuit

Impacted Products: Integrated Circuit

Manufacturers: Intel

Summary: Intel has introduced a new integrated chip designed for electric vehicles (EVs), aimed at improving performance and efficiency. This chip combines multiple functions into a single package, reducing the complexity and cost of EV power systems while enhancing overall vehicle efficiency and reliability.

8. Source:EENews Europe – Mitsubishi Ships SiC Modules

Date: June 11, 2024

Keywords: Mitsubishi, SiC modules, SBD

Impacted Products: SiC

Manufacturers: Mitsubishi

Summary: Mitsubishi Electric has begun shipping Silicon Carbide (SiC) power modules integrated with Schottky Barrier Diodes (SBDs). These advanced modules are designed to enhance efficiency and performance in power conversion applications, making them suitable for use in renewable energy systems, electric vehicles, and industrial equipment.

9. Source: TrendForce – IC Design Companies Adopt TSMC’s 3nm Process

Date: June 13, 2024

Keywords: TSMC, 3nm process, IC design, price hikes

Impacted Products: Integrated Circuits

Manufacturers: —

Summary: IC design companies are increasingly adopting TSMC’s 3nm process technology, leading to cost-driven price increases. This shift aims to enhance performance and energy efficiency in high-end computing and mobile devices, though it also brings higher production costs that are being passed on to customers.

10. Source: All About Circuits – ST Rolls Out New IMU

Date: June 12, 2024

Keywords: STM, IMU

Impacted Products: IMU

Manufacturers: STMicroelectronics

Summary: STMicroelectronics has launched a new Inertial Measurement Unit (IMU) tailored for industrial and robotic applications. This IMU offers enhanced performance in motion tracking and stability, making it ideal for use in automation, robotics, and industrial machinery.